
Testing photonic integrated circuits (PICs) poses unique challenges compared to traditional IC chip testing due to the requirement for both electrical and optical probing. This PIC testing can be conducted at the wafer level (Wafer Level Testing) or after the chip has been diced or cleaved (Die Level Testing). Precise alignment of optical probes with sub-micrometer precision is crucial for characterizing photonic waveguide components. VLC Photonics offers comprehensive manual and automated testing capabilities tailored to your project requirements.
The photonic testing will be charged at €250/h plus any additional material costs required for the project.
Timeframes and deadlines to be discussed on a per-project basis.
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